Electronic integration technologies:
applications and development perspectives
â– Times have changed! Technology no longer makes Applications; instead, Applications are pulling up Technology! The field of electronics has entered a new era. The watchwords are now: Smaller, Lighter, Faster, Cheaper. From ASIC to PCB, all steps in integrating a function are concerned by the Packaging concept. This is what makes the function, but it’s also what holds it back. The cost of sale depends on the way in which a unit is “packaged”.
This survey shows that other parameters are now involved in the technical choices of electronic architecture. The notion of integration has changed in the current context. The position of Europe on a market that is about to double the automobile market is mentioned. The major issues of the moment are documented. The emerging relationship between Environment and the electronic Industry is detailed. A paragraph is devoted to the Durability of technological solutions; Next generation technologies are described in detail. The main factors that influence integration are included in the third chapter. The following, highly technical subjects are covered: integration density, electrical and thermal performances, quality, reliability, cost, testability and connections. Several applications are described in the last chapter, which finishes with industrial resources. A paragraph is dedicated to choosing the branch. A set of decision-making grids is included. The new DFM, DFT and DFE approaches are covered.
In a difficult technical field, this study is of interest to a diversity of readers: for decision-makers, there are elements to help with strategic and development choices; for integrators, possible solutions are suggested with decision-making elements; lastly, for developers, the technical elements to take into consideration for a good design.
- Publication: October 1999
- ISBN: 2-906024-45-7